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Introduction Major Achievements and Activities Funding sources Research Facilities Laboratory
Introduction
The group of integrated circuits (IC) focuses on studying RF, analog, and digital integrated circuits and systems. The target applications and ongoing research projects include high-speed wire-line transceivers (SERDES, Display Port, UHDTV), data converters, clock generators (PLL, DLL, SSCG), power management circuits, sensor interface ICs, terahertz circuits and systems, millimeter-wave circuits, communication baseband processors, image/video processing modules, robot vision processors, embedded/off-ship memory, ultra-low powered sub-threshold circuits. The designed circuits and systems are widely used in HD display interfaces, digital TVs, microprocessors and mobile application/baseband processors (AP, BP), energy harvesting systems, bio-medical chips, sensor networks, ultra high-speed communication systems, high-resolution imagers, automotive semiconductor systems.
In the field Integrated Circuits, there are 5 full-time professors, 45 Ph.D. students and 24 MS students.
Major Achievements and Activities
  • 6 projects with Samsung, Hynix, hyundai motor during the past two years.
  • The Bronze Award of  Dongbu Hitek Semiconductor Design Award(2012). The 1st place of Dongbu Hitek Semiconductor Design Award(2011), The 10th Semiconductor Enginnering Contest Award(2009), The Bronze Award of Samsung Electro-Mechanics 5th ‘1nside Edge’ International Thesis Competition(2009).
  • Most of the R&D projects are funded by government and private sector such as Battelle, Samsung, LG and Hynix.
  • Recipient of IEEE George E. Smith Award (IEEE EDL best paper award), 2002 and 2006.
  • IEEE International Low Power Design Contest Award (2001), ACM/IEEE DAC Student Design Contest Award (2002), ASP-DAC Best Design Award (2008).
  • Wide-range and high-resolution DCC – Used in 54nm 7Gbps Hynix graphics memory GDDR5 chip.
  • Multiphase clock generator tile for 1.2GHz RISC microprocessor – Used in Samsung Electronics 1.2GHz ARM10 CPU.
  • Technical program committee (VLSI Design 2010 ~ present, ASP-DAC 2011~ present), Bio-sensing and Bio application DSP system design session invited speaker (ASQED 2010).
  • Various low-power SoC and embedded SRAM developments  (Wi-Fi 802.11.n, DVB-H, ATSC, Tuner DSP ).
  • Over 446 international journal and conference papers
Funding sources
  • The Ministry of Commerce, Industry and Energy
  • The Ministry of Education
  • Korea Science and Engineering Foundation
  • Korea Research Foundation
  • Korea Electric Power Corporation
  • Korea Power Exchange
  • Korea Electric Power Data Network
  • Samsung Electronics Co., Ltd.
  • Hyundai Heavy Industries
  • Hyundai Motor Company
  • Next Generation Vehicle Technology
  • LS Industrial Systems Co., Ltd.
  • GE Global Research Center
  • GE Energy
  • POSCON Research Laboratory
  • The Small and Medium Business Administration
  • Korea Electric Power Research Institute
  • Korea Electro technology Research Institute
  • Korea Railroad Research Institute
  • Korean Electrical Engineering & Science Research Institute
Research Facilities
  • Computing Resources and Software
    • 10 HP Enterprise 450 Servers
    • 10 SUN Ultra-60 Dual Processor Workstations
    • OPNET
    • Cadence
    • Synopsys
    • Mentor
  • Testbed
    • 180 cubic meters testbed
    • Network Analyzer
    • Multipurpose Test Equipment and accessories
  • Semiconductor Fabrication Lab
    • TEM
    • SEM
    • XRD
    • SIMS
    • Auger
    • Raman
    • TGA
    • DTA
    • I-V characteristic measurement
    • C-V characteristic measurement
    • HP 4145
    • HP 4147
    • Low temperature I-V measurement
    • RF I-V measurement
    • Sever (SunFire V480)
    • Sever (SV4500)
    • Sever (SE4500)
    • Digital Storage Oscilloscope (Tektronix TDS6154C)
    • Digital Sampling Oscilloscope (Tektronix TDS8200)
    • Digital Oscilloscope (Tektronix TDS784D)
    • Spectrum Analyzer (HP 8596E)
    • Signal Generator (Agilent E4426B)
    • Arbitrary Waveform Generator (Tektronix AWG420)
    • ADC Evaluation Kit (Analog Devices HSC-ADC-EVAL-DC)
    • Programmable Power Supply (Tektronix PS2520G)
    • Multimeter (Keithley 2000)
Laboratory
  • Ultra Large Scale Integrated Circuits
  • The smaller the size of IC (integrate Circuits) chips which have better ability than the past ones is, the more complex the methods of design that ICs is made on single chip becomes. So we are studying circuit design, which computer is used on, for accurate and fast design. SOC 1 Team is researching Digital Circuits Design.

    As Analog & Digital systems are built on single chip, many problems, which have been not considered, occur. SOC 2 team deals with these problems that happen, when we design circuits with high performance. Analog to Digital Converter (ADC) which represents Mixed IC is one of the research areas we have been focusing on. Even though digital signal is in the limelight nowadays, it is necessary that converting digital signal into analog signal (which fits human senses) or vice versa. Thus Front-end of Digital signal processing is in need of AD or DA. Therefore, ADC is also important part in Digital System.

    SOC 3 team is dedicated to pursue something far more complex than just simply Digital. There is no doubt that we want to express everything in just "black and white" for simplicity, but we cannot comprehend and express the natural principle and phenomenon by means of only Digital. Our mission is to combine Digital and Analog to create a truly enhanced Advanced Mixed Signal. All signals in nature consist of analog representation containing infinite information. In addition, the system inputs and outputs that people utilize are Analog as well. However, information processing is more efficient and effective with Digital than Analog. Hence, the combination of the two signals will create an ideal high performance system. Main projects that are under research in ULSI Laboratory Include:
    • Research and Development of Electrical Models of TFT-LCD panels
    • LCD Driving System Modeling
    • High speed, low voltage, small area DLL design for DDR3 SDRAM
    • High speed, low power AD Converter & DA Converter for UWB
    • Design of Low Power Analog Circuit for high speed SDRAM
    • Design of CDR Transceiver
    • Fault Models and Test Algorithm for 3-D SRAMs
    • Implementation of MDDI Single Chip MAC+PHY IC
    • Implementation of H.264/AVC for Mobile Video Applications

    For more information, contact : Dr. Suk Ki Kim

    Tel
    +82-2-3290-3223
    E-mail
    skkim@korea.ac.kr
    Homepage
    http://ulsi.korea.ac.kr
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  • ASIC design Laboratory
  • ASIC design Laboratory image ASIC design Laboratory imageASIC (Application-Specific Integrated Circuit) stands for the IC designed and manufactured for specific use with the requested specification by customer. ASIC Design Laboratory conducts research in the area of high-speed transceivers for high-speed data communication systems and high-speed interface systems such as SERDES and PLLs.

    Also research activities are focused on the development of low-power analog/digital mixed-mode signal circuits and system on a chip (SoC) such as cardiac pacemaker system and smart-sensor interface ICs and A/D, D/A data converters. Main projects that are under research in ASIC Design Lab. Includes:
    • Design of High-Speed Transceivers for High Speed Data Communication System
    • High-Speed Interface System such as SERDES and PLL
    • Low-Power Analog/Digital Mixed-Mode Circuit Design and SoC
    • Cardiac Pacemaker System IC for Implantable Biomedical System
    • Smart-Sensor interface IC

    For more information, contact : Dr. Soowon Kim

    Tel
    +82-2-3290-3224
    E-mail
    ksw@asic.korea.ac.kr
    Homepage
    http://asic.korea.ac.kr
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  • Advanced Integrated System Laboratory
  • Advanced Integrated System  Laboratory image Advanced Integrated Systems Laboratory is interested in the areas of cutting-edge mixed-mode IC design, next-generation VLSI system design, and low-power SoC design.
    Major projects include :
    • Giga bps Transceiver (SERDES)
    • High-speed ADC / Low-power ADC
    • DDR3 / GDDR4 : DLL, I/O
    • 2Gbps Transceiver for Flat Panel Display (LCD, PDP)
    • Dynamic Power Management / Temperature Sensor
    • PLL / DLL / SSCG
    • Wireless integrated Gigabit System (WPAN, MIMO Transceiver)
    • Network on Chip

    For more information, contact : Dr. Chulwoo Kim

    Tel
    +82-2-3290-3252
    E-mail
    ckim@korea.ac.kr
    Homepage
    http://kilby.korea.ac.kr
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  • High-Speed Integrated Systems Laboratory
  • In the High-Speed Integrated Systems Laboratory (HSISL), researches related to millimeter-wave applications as well as advanced semiconductor devices are being actively performed. The details of the research subjects are described below:
    • Modeling of high-speed active devices such as SiGe HBT and RFCMOS for various mm-wave applications (f > 30 GHz), which include 60 GHz WPAN (Wireless Personal Area Network) and 77GHz automotive radar systems
    • Modeling of passive devices such as inductors, capacitors, resistors, and transmission lines for various mm-wave applications
    • Modeling of the coupling through substrate between devices, which becomes increasingly important with raised operation frequency and trend for SoC (System-on-chip).
    • Design of circuits for mm-wave transceiver applications such as LNAs (low noise amplifiers), VCOs (voltage-controlled oscillators), mixers, and PAs (power amplifiers), mostly based on Si technology
    • Design and fabrication of PMOS devices with Ge or SiGe film incorporated as the channel layer, which benefits from the high hole mobility of Ge or SiGe layers
    • Modeling of the gate leakage for sub-100 nm CMOS devices, which becomes increasingly important for the nano-scale CMOS devices as the gate leakage exponentially increases with decreased gate dielectric thickness, a critical issue for low power operation

    For more information, contact : Dr. Jae-Sung Rieh

    Tel
    +82-2-3290-3257
    E-mail
    jsrieh@korea.ac.kr
    Homepage
    http://hsisl.korea.ac.kr
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  • VLSI Signal Processing Laboratory
  • The primary goal of the VLSI Signal Processing Laboratory is to develop core technologies for low-power, high-performance and reliable integrated systems design. The research area is in digital and mixed-signal circuit/system design in scaled-CMOS and post-CMOS technologies. Target applications encompass communication baseband processor, image/video processing modules, portable computing, sensor networks, robot vision processor, embedded/off-chip memory interfaces and, ultra low-power biomedical implantable devices. Our research team's effort focuses on the cooperative field of device/circuit/architecture/algorithm for designing high-performance, low-power and reliable VLSI signal processing system design in nanometer regime.
    Our research area is as follows:
    • Low-power MIMO/OFDM baseband processor design
    • VLSI implementation of error correction codes (ECC) for high speed PCRAM/DRAM interfaces
    • Design of robot vision processor for supporting multiple camera operations
    • Priority (Sensitivity) based low-power/variation-tolerant Digital Signal Processing
    • Efficient interface design of embedded memory (SRAM) for low power MPEG/H.264 applications
    • Sub-threshold circuit design for ultra low-power biomedical applications
    • Memory based computation of cryptography processor design
    • Timing/Freq. offset synchronizer design for vehicle to vehicle communication

    For more information, contact : Dr. Jongsun Park

    Tel
    +82-2-3290-4827
    E-mail
    jongsun@korea.ac.kr
    Homepage
    http://vlsisp.korea.ac.kr
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